PACK EXPO International

Where: Chicago, Illinois

Unlock strategic opportunities across packaging and smart machinery at PACK EXPO.

Roman Göd, Rodrigo Gonzales Reyes and Gregor Nischer will be attending the upcoming PACK EXPO event in Chicago. Take this chance to discuss the latest M&A trends, market developments and growth potential across the packaging and smart machinery sectors with us.

Let’s connect and discover your next strategic move together.

Ready to start?!

Our teams of specialised dealmakers and ambitious M&A
challengers, are ready to take on your challenge – and exceed your expectations, every day.

  • Market leader in industrial M&A
  • 700+ industrial M&A projects
  • 85+ professionals form the largest industrial M&A team
  • Adding credibility to your deal
  • Maximising your value with our challenger mindset